| Description |
Low Temperature Co-fired Ceramic (LTCC) is a glass-ceramic, multilayer circuit and electronic package preparation process that has great advantages over the other, more conventional electronic packaging technologies. This process allows very high interconnect density due to multilayering capability, can integrate passive components, handle very large numbers of Input-output (I/O) connections and at the same time has a capability to cater to high frequency (HF) circuit needs. The low firing temperatures enable use of precious metals like Ag, Au, and Ag/Pd, Au/Pt alloys into LTCC as conductors, lowering the cost immensely as compared to its predecessor, viz. High Temperature Co-fired Ceramic (HTCC) technology. The flexible manufacturing process of LTCC also allows its use as structural, supporting material as well as in preparing sensors and actuators themselves. The LTCC technology does, however, have some limitations, such as, high shrinkage tolerance, non-flexibility and low thermal conductivity. In spite of these disadvantages, LTCC holds great promise in development of total integrated solutions inclusive of wireless front ends, sensors, actuators and digital circuits finding applications in consumer medical, space and military electronic systems alike.
About Dr. Girish Phatak :
Girish Phatak received his M.Sc. from University of Pune and Ph.D. from IIT Bombay. He did his Post Doctoral Research at Nagoya University on MONBUSHO fellowship from Govt. of Japan. He published over 25 research papers in renowned Journals. He is currently involved in several projects of national importance where he is contributing in development of special packages and circuits.
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